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Shubham Badjate
at KLA Corp
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Publications (1)
Proceedings Article | 10 April 2024 Presentation + Paper
Advanced processing control for wafer-to-wafer hybrid bonding
Nikhil Aditya Kumar Roy, Richard Housley, Dan Engelhard, Hao Wang, Cassie Bayless, Chris Nguyen, Franz Zach, Shubham Badjate, Abhishek Gottipati, Yoav Grauer, Oren Ben-Nun, Roie Volkovich
Proceedings Volume 12955, 129551Q (2024) https://doi.org/10.1117/12.3010036
KEYWORDS: Wafer bonding, Overlay metrology, Semiconducting wafers, Process control, Metrology, 3D metrology, Optical parametric oscillators, Advanced process control, 3D acquisition, Distortion
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