We demonstrate a 3D integrated 2D addressable VCSEL array that integrates high power 2D VCSEL array on a circuit board with a built-in laser driver by flip-chip bonding, resulting in high optical power density of 1,500 W/mm2 and short pulse duration of 2 ns. Each VCSEL is designed to oscillate at 940 nm and has seven junctions, large optical aperture and Cu pillar bumps for individual driving. Compared to our previous report5 , the optical output power is improved from 45 to 80 W/channel by increasing filling factor which is the ratio of active area to chip size from 33 % to 59 % and decreasing operating voltage by changing donor in tunnel junction from Si to Te. Additionally, the optical pulse shape has short rise time 1 ns and a narrow pulse width of 2 ns thanks to low inductance in this unique structure, and highly uniform optical pulse shape was observed in the plane due to small deviation of inductance from various positions of VCSEL array. We also confirmed that there was no degradation after 1000 hours of operation at an ambient temperature of 105 °C and 40 V, and after 1000 cycles of temperature cycle test from -40 to 125 °C in the module configuration. We believe that this advanced 3D integrated 2D addressable VCSEL array is the candidate for a light source of advanced LiDAR system with "ROI" (region of interest) focusing and low power consumption due to its zone-emission characteristics.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.