We demonstrate a 3D integrated 2D addressable VCSEL array that integrates high power 2D VCSEL array on a circuit board with a built-in laser driver by flip-chip bonding, resulting in high optical power density of 1,500 W/mm2 and short pulse duration of 2 ns. Each VCSEL is designed to oscillate at 940 nm and has seven junctions, large optical aperture and Cu pillar bumps for individual driving. Compared to our previous report5 , the optical output power is improved from 45 to 80 W/channel by increasing filling factor which is the ratio of active area to chip size from 33 % to 59 % and decreasing operating voltage by changing donor in tunnel junction from Si to Te. Additionally, the optical pulse shape has short rise time 1 ns and a narrow pulse width of 2 ns thanks to low inductance in this unique structure, and highly uniform optical pulse shape was observed in the plane due to small deviation of inductance from various positions of VCSEL array. We also confirmed that there was no degradation after 1000 hours of operation at an ambient temperature of 105 °C and 40 V, and after 1000 cycles of temperature cycle test from -40 to 125 °C in the module configuration. We believe that this advanced 3D integrated 2D addressable VCSEL array is the candidate for a light source of advanced LiDAR system with "ROI" (region of interest) focusing and low power consumption due to its zone-emission characteristics.
We fabricated a high output power large-scale 2D addressable VCSEL array and demonstrated a small footprint transmitter (Tx) module for true solid-state LiDAR. The module integrated VCSEL array and laser diode driver built-in circuit board in three dimensions. Each used VCSEL had five junctions, large optical aperture, and bump for individual driving. The wavelength of light output through a substrate was 940 nm. VCSELs were arranged in 48×48 matrix wherein 2,304 emitters can be individually driven. The array chip was assembled on the circuit board by flip-chip bonding via bump. All VCSELs were connected to the driver with very short current path caused by the three-dimensional integration. Short current path and small current loop resulted in small resistance and inductance, which facilitated driving of VCSELs with short current pulse. The transmitter module can generate high peak power with short pulse duration for time-of-flight measurement without RF input. Each VCSEL can be sequentially driven by trigger pulse input. The footprint of the module was 17.3 mm square. We confirmed that all VCSELs emit with sequential driving mode; the peak output power was over 45 W and pulse width was approximately 4 ns. The pulse shapes and widths were nearly identical at the center and edge of the array, which is generally unusual for a Tx module with two-dimensional integration where VCSEL and laser driver are integrated side by side. The divergence of output was less than 10°.
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