Dr. Sayantan Das Profile

Dr. Sayantan Das

at imec

SPIE Involvement:

Author

Publications (25)

SPIE Journal Paper | 19 October 2023

Applications of large field of view e-beam metrology to contour-based optical proximity correction modeling

Chih-I Wei, Seulki Kang, Sayantan Das, Masahiro Oya, Yosuke Okamoto, Kotaro Maruyama, Germain Fenger, Azat Latypov, Ir Kusnadi, Gurdaman Khaira, Yuichiro Yamazaki, Werner Gillijns, Sandip Halder, Gian Lorusso

JM3, Vol. 22, Issue 04, 041603, (October 2023) https://doi.org/10.1117/12.10.1117/1.JMM.22.4.041603

KEYWORDS: Modeling, Data modeling, Semiconducting wafers, Optical proximity correction, Contour modeling, Metrology, Calibration, Stochastic processes, Scanning electron microscopy, Performance modeling

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SPIE Journal Paper | 1 March 2023

Defect detection and classification on imec iN5 node BEoL test vehicle with multibeam scanning electron microscope

Jens Timo Neumann, Abhilash Srikantha, Philipp Hüthwohl, Keumsil Lee, James William B., Thomas Korb, Eugen Foca, Tomasz Garbowski, Daniel Boecker, Sayantan Das, Sandip Halder

JM3, Vol. 22, Issue 02, 021009, (March 2023) https://doi.org/10.1117/12.10.1117/1.JMM.22.2.021009

KEYWORDS: Defect detection, Education and training, Back end of line, Image restoration, Image classification, Data modeling, Scanning electron microscopy, Process modeling, Machine learning, Electron microscopes

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Proceedings Article | 1 December 2022 Poster + Paper

Poster + Paper

Single mask solution to pattern BLP and SNLP using 0.33NA EUV for next-generation DRAM manufacturing

Kaushik Sah, Andrew Cross, Sayantan Das, Roberto Fallica, Jeonghoon Lee, Ryoung-Han Kim, Sandip Halder, Ethan Maguire, Ana-Maria Armeanu, Monica Sears, Neal Lafferty, Vlad Liubich, Chih-i Wei, Germain Fenger

Proceedings Volume 12292, 122920W (2022) https://doi.org/10.1117/12.2645953

KEYWORDS: Photomasks, Optical proximity correction, Stochastic processes, Extreme ultraviolet, Semiconducting wafers, Wafer-level optics, Source mask optimization, Manufacturing, Inspection, Signal to noise ratio, Defect inspection

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Proceedings Article | 31 October 2022 Poster

Poster

Deep-learning denoiser-assisted framework for robust SEM contour extraction and analysis for advanced semiconductor node

Bappaditya Dey, Sandip Halder, Argho Das, SAYANTAN DAS, STEWART WU, Germain Fenger

Proceedings Volume PC12292, PC122920Z (2022) https://doi.org/10.1117/12.2645403

KEYWORDS: Scanning electron microscopy, Semiconductors, Data modeling, Photomasks, Metrology, Calibration, Wafer-level optics, Stochastic processes, Shape analysis, Semiconducting wafers

SPIE Journal Paper | 28 October 2022

Investigating metal oxide resists for patterning 28-nm pitch structures using single exposure extreme ultraviolet: defectivity, electrical test, and voltage contrast study

Sujan Sarkar, Sayantan Das, Victor M. Blanco Carballo, Philippe Leray, Sandip Halder

JM3, Vol. 21, Issue 04, 044901, (October 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.4.044901

KEYWORDS: Semiconducting wafers, Metals, Critical dimension metrology, Oxides, Scatterometry, Inspection, Stochastic processes, Electron beam lithography, Metrology, Ruthenium

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Proceedings Article | 26 May 2022 Presentation + Paper

Presentation + Paper

E-beam metrology-based EUVL aberration monitoring

Seulki Kang, Yuji Miura, Kotaro Maruyama, Yuichiro Yamazaki, Chih-I Wei, Ethan Macguire, Germain Fenger, Peter De Bisschop, Sayantan Das, Sandip Halder, Gian Lorusso

Proceedings Volume 12053, 120530Z (2022) https://doi.org/10.1117/12.2615955

KEYWORDS: Semiconducting wafers, Error analysis, Metrology, Scanners, Data modeling, Extreme ultraviolet lithography, Extreme ultraviolet, Wavefronts, Modulation, Wavefront aberrations

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Proceedings Article | 26 May 2022 Presentation + Paper

Presentation + Paper

Defect detection and classification on imec iN5 node BEoL test vehicle with MultiSEM

Jens Timo Neumann, Abhilash Srikantha, Philipp Hüthwohl, Keumsil Lee, James William B., Thomas Korb, Eugen Foca, Tomasz Garbowski, Daniel Boecker, Sayantan Das, Sandip Halder

Proceedings Volume 12053, 120530I (2022) https://doi.org/10.1117/12.2619766

KEYWORDS: Defect detection, Image classification, Data modeling, Bridges, Back end of line, Visualization, Sensors, Inspection, Semiconductors

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Proceedings Article | 25 May 2022 Presentation + Paper

Presentation + Paper

EUV based multi-patterning schemes for advanced DRAM nodes

Sayantan Das, Kaushik Sah, Roberto Fallica, Zhijin Chen, Sandip Halder, Andrew Cross, Danilo De Simone, Fergo Treska, Philippe Leray, Ryoung Han Kim, Ethan Maguire, Chih-I Wei, Germain Fenger, Neal Lafferty, Jeonghoon Lee

Proceedings Volume 12055, 1205503 (2022) https://doi.org/10.1117/12.2615644

KEYWORDS: Etching, Photomasks, Extreme ultraviolet, Optical lithography, Double patterning technology

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Proceedings Article | 13 October 2021 Presentation + Paper

Presentation + Paper

Deep learning-based defect detection using large FOV SEM for 28 nm pitch BEOL layer patterned with 0.33NA single exposure EUV

Sayantan Das, Kaushik Sah, Ardis Liang, Hemanta Roy, Kha Tran, Binesh Babu, Arjun Hegde, Andrew Cross, Philippe Leray, Sandip Halder

Proceedings Volume 11854, 118540Y (2021) https://doi.org/10.1117/12.2600954

KEYWORDS: Inspection, Defect detection, Semiconducting wafers, Scanning electron microscopy, Extreme ultraviolet lithography, Critical dimension metrology, Etching

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Proceedings Article | 12 October 2021 Presentation + Paper

Presentation + Paper

28nm-pitch Ru interconnects patterned with a 0.33NA-EUV single exposure

Sayantan Das, Nicola Kissoon, Mahmudul Hasan, Luc Rynders, Luka Kljucar, Sandip Halder, Philippe Leray, Mircea Dusa, David Rio, Mahmoud Mohsen, Chris Spence, Etienne De Poortere

Proceedings Volume 11854, 118540C (2021) https://doi.org/10.1117/12.2600937

KEYWORDS: Stochastic processes, Semiconducting wafers, Ruthenium, Inspection, Extreme ultraviolet lithography, Line edge roughness

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Proceedings Article | 12 October 2021 Poster + Presentation + Paper

Poster + Presentation + Paper

iN5 EUV single expose patterning evaluation for via layers

Argho Das, Victor Blanco, Sayantan Das, Nicola Kissoon, Sandip Halder, Mircea Dusa

Proceedings Volume 11854, 1185418 (2021) https://doi.org/10.1117/12.2600938

KEYWORDS: Etching, Logic, Critical dimension metrology, Inspection, Extreme ultraviolet lithography, Semiconducting wafers, Electron beam lithography, Optical lithography, Metrology, Diffractive optical elements

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Proceedings Article | 12 October 2021 Presentation + Paper

Presentation + Paper

Unsupervised machine learning based SEM image denoising for robust contour detection

Bappaditya Dey, Stewart Wu, Sayantan Das, Kasem Khalil, Sandip Halder, Philippe Leray, Samir Bhamidipati, Kiarash Ahi, Mark Pereira, Germain Fenger, Magdy Bayoumi

Proceedings Volume 11854, 1185411 (2021) https://doi.org/10.1117/12.2600945

KEYWORDS: Scanning electron microscopy, Denoising, Machine learning, Bridges, Metrology, Stochastic processes, Image processing, Neural networks, Detection and tracking algorithms, Optical proximity correction

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Contour detection of an object is a fundamental computer vision problem in image processing domain. The goal is to find a concrete boundary for pixel ownership between an OOI (object-of-interest) and its corresponding background. However, contour extraction from low SN SEM images is a very challenging problem as different sources of noise shadow the estimation of underlying structural geometries. As device scaling continues to 3nm node and below, the extraction of accurate CD contour geometries from SEM images especially ADI (after developed inspection) is of utmost importance for a qualitative lithographic process as well as to verify device characterization in aggressive pitches. In this paper, we have applied a U-Net architecture based unsupervised machine learning approach for de-noising CD-SEM images. Unlike other discriminative deep-learning based de-noising approaches, the proposed method does not require any ground-truth as clean/noiseless images or synthetic noiseless images for training. Simultaneously, we have also attempted to demonstrate how de-noising is helping to improve the contour detection accuracy. We have analyzed and validated our result by using a programmable tool (SEMSuiteTM) for contour extraction. We have de-noised SEM images with categorically different geometrical patterns such as L/S (line-space), T2T (tip-to-tip), pillars with different scan types etc. and extracted the contours in both noisy and de-noised images. The comparative analysis demonstrates that de-noised images have higher confidence contour metric than their noisy twins while keeping the same parameter settings for both data input. When the ML algorithm is applied, the contour extraction results would have higher confidence numbers comparing with the ones only applied the conventional Gaussian or Median blur de-noise method. The final goal of this work is to establish a robust de-noising method to reduce the dependency of SEM image acquisition settings and provide more accurate metrology data for OPC calibration.

Proceedings Article | 22 February 2021 Poster + Paper

Poster + Paper

Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes

Kaushik Sah, Andrew Cross, Sayantan Das, Victor Blanco, Luka Kljucar, Sandip Halder, Philippe Leray

Proceedings Volume 11611, 116112H (2021) https://doi.org/10.1117/12.2585779

KEYWORDS: Extreme ultraviolet, Optical lithography, Scanning electron microscopy, Stochastic processes, Lithography, Back end of line, Ultraviolet radiation, Photomasks, Optical inspection, Metals

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Proceedings Article | 22 February 2021 Presentation + Paper

Presentation + Paper

Defect characterization of 28 nm pitch EUV single patterning structures for iN5 node

Kaushik Sah, Sayantan Das, Andrew Cross, Kay Peng, Kha Tran, Binesh Babu, Ardis Liang, Danilo De Simone, Philippe Leray, Sandip Halder

Proceedings Volume 11611, 1161128 (2021) https://doi.org/10.1117/12.2584760

KEYWORDS: Semiconducting wafers, Extreme ultraviolet, Electron beam lithography, Optical inspection, Inspection, Wafer-level optics, Wafer inspection, Stochastic processes, Optics manufacturing, Lithography

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Proceedings Article | 22 February 2021 Presentation + Paper

Presentation + Paper

Scatterometry solutions for 14nm half-pitch BEOL layers patterned by EUV single exposure

Sayantan Das, Joey Hung, Sandip Halder, Roy Koret, Igor Turovets, Anne-Laure Charley, Philippe Leray

Proceedings Volume 11611, 116112A (2021) https://doi.org/10.1117/12.2583714

KEYWORDS: Scatterometry, Metals, Extreme ultraviolet, Copper, Ruthenium, Scanners, Photoresist processing, Performance modeling, Oxides, Optical lithography

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Proceedings Article | 22 February 2021 Presentation + Paper

Presentation + Paper

Better prediction on patterning failure mode with hotspot aware OPC modeling

Chih-I Wei, Stewart Wu, Yunfei Deng, Gurdaman Khaira, Ir Kusnadi, Germain Fenger, Seulki Kang, Yosuke Okamoto, Kotaro Maruyama, Yuichiro Yamazaki, Sayantan Das, Sandip Halder, Werner Gillijns, Gian Lorusso

Proceedings Volume 11611, 1161112 (2021) https://doi.org/10.1117/12.2583837

KEYWORDS: Optical proximity correction, Electron beam lithography, 3D modeling, Inspection, Calibration, Lithography, Data modeling, Time metrology, Semiconducting wafers, Scanning electron microscopy

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Proceedings Article | 22 February 2021 Presentation + Paper

Presentation + Paper

Privacy preserving amalgamated machine learning for process control

Wilfried Verachtert, Thomas Ashby, Imen Chakroun, Roel Wuyts, Sayantan Das, Sandip Halder, Philippe Leray

Proceedings Volume 11611, 116111F (2021) https://doi.org/10.1117/12.2584893

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Proceedings Article | 22 February 2021 Presentation + Paper

Presentation + Paper

Massive e-beam metrology and inspection for analysis of EUV stochastic defect

Seulki Kang, Kotaro Maruyama, Yuichiro Yamazaki, Danilo De Simone, Paulina Rincon-Delgadillo, Andreas Frommhold, Gian Lorusso, Sayantan Das, Sandip Halder, Philippe Leray

Proceedings Volume 11611, 1161129 (2021) https://doi.org/10.1117/12.2584696

KEYWORDS: Stochastic processes, Metrology, Extreme ultraviolet, Inspection, Scanning electron microscopy, Extreme ultraviolet lithography, Defect detection, Statistical methods, Photoresist materials, Optical correlators

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Proceedings Article | 2 April 2020 Paper

Paper

Massive metrology of 2D logic patterns on BEOL EUVL

Sayantan Das, Seulki Kang, Sandip Halder, Kotaro Maruyama, Philippe Leray, Yuichiro Yamazaki

Proceedings Volume 11325, 113250J (2020) https://doi.org/10.1117/12.2554543

KEYWORDS: Metrology, Extreme ultraviolet lithography, Logic, Scanning electron microscopy, Back end of line, Metals, Semiconducting wafers, Optical proximity correction, OLE for process control, Electron beam lithography

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Proceedings Article | 23 March 2020 Paper

Paper

Unsupervised machine learning based CD-SEM image segregator for OPC and process window estimation

Bappaditya Dey, Dorin Cerbu, Kasem Khalil, Sandip Halder, Philippe Leray, Sayantan Das, Yasser Sherazi, Magdy Bayoumi, Ryoung Han Kim

Proceedings Volume 11328, 113281G (2020) https://doi.org/10.1117/12.2552055

KEYWORDS: Image processing, Optical proximity correction, Machine learning, Computer programming, Photomasks, Stochastic processes, Defect inspection, Semiconducting wafers, Analytical research, Vector spaces

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Proceedings Article | 20 March 2020 Presentation + Paper

Presentation + Paper

Realizing more accurate OPC models by utilizing SEM contours

Chih-I Wei, Rajiv Sejpal, Yunfei Deng, Ir Kusnadi, Germain Fenger, Masahiro Oya, Yosuke Okamoto, Kotaro Maruyama, Yuichiro Yamazaki, Sayantan Das, Sandip Halder, Werner Gillijns

Proceedings Volume 11325, 1132524 (2020) https://doi.org/10.1117/12.2554527

KEYWORDS: Scanning electron microscopy, Data modeling, Calibration, Optical proximity correction, Semiconducting wafers, Metrology, Image processing, 3D modeling, Photomasks, Image quality

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Proceedings Article | 20 March 2020 Paper

Paper

Massive metrology for process development and monitoring applications

Kaushik Sah, Sayantan Das, Shifang Li, Christophe Beral, Andrew Cross, Sandip Halder

Proceedings Volume 11325, 1132528 (2020) https://doi.org/10.1117/12.2553092

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Metrology, Modulation, Inspection, Copper, Chemical mechanical planarization, Defect inspection, Extreme ultraviolet lithography, Back end of line

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Proceedings Article | 25 June 2019 Open Access

Open Access

Paper

Machine learning for predictive electrical performance using OCD (Erratum)

Sayantan Das, Joey Hung, Sandip Halder, Guillaume Schelcher, Roy Koret, Igor Turovets, Mohamed Saib, Anne-Laure Charley, Matthew Sendelbach, Avron Ger, Philippe Leray

Proceedings Volume 10959, 1095932 (2019) https://doi.org/10.1117/12.2541616

KEYWORDS: Machine learning, Metrology, Inspection, Process control, Optical lithography, Capacitance, Lithography

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Proceedings Article | 26 March 2019 Paper

Paper

E-beam inspection of single exposure EUV direct print of M2 layer of N10 node test vehicle

Sayantan Das, Ryo Shimoda, Shinji Mizutani, Sandip Halder, Kotaro Maruyama, Philippe Leray, Yuichiro Yamazaki

Proceedings Volume 10959, 109590H (2019) https://doi.org/10.1117/12.2515809

KEYWORDS: Scanning electron microscopy, Critical dimension metrology, Metrology, Extreme ultraviolet lithography, Distortion, Logic, Metals, Extreme ultraviolet, Inspection, Semiconducting wafers

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Proceedings Article | 26 March 2019 Paper

Paper

Machine learning for predictive electrical performance using OCD

Sayantan Das, Joey Hung, Sandip Halder, Guillaume Schelcher, Roy Koret, Igor Turovets, Mohamed Saib, Anne-Laure Charley, Matthew Sendelbach, Avron Ger, Philippe Leray

Proceedings Volume 10959, 109590F (2019) https://doi.org/10.1117/12.2515806

KEYWORDS: Machine learning, Semiconducting wafers, Capacitance, Resistance, Critical dimension metrology, Etching, Process control, Diffractive optical elements, Oxides, Scatterometry

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Showing 5 of 25 publications

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