Mr. Mark Kelling Profile

Mark Kelling

at Global 450 Consortium (G450C)

SPIE Involvement:

Author

Publications (9)

Proceedings Article | 23 March 2016 Paper

450mm etch process development and process chamber evaluation using 193i DSA guided pattern

Wenli Collison, Yii-Cheng Lin, Shannon Dunn, Hiroaki Takikawa, James Paris, Lucy Chen, Troy Detrick, Jun Belen, George Stojakovic, Michael Goss, Norman Fish, Minjoon Park, Chih-Ming Sun, Mark Kelling, Pinyen Lin

Proceedings Volume 9782, 97820M (2016) https://doi.org/10.1117/12.2218537

KEYWORDS: Etching, Semiconducting wafers, Data processing, Lithography, Directed self assembly, Optical lithography, Tin, Photoresist processing, Line edge roughness, Polymethylmethacrylate

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Proceedings Article | 4 April 2012 Paper

Hybrid metrology solution for 1X-node technology

Alok Vaid, Alexander Elia, Mark Kelling, John Allgair, Carsten Hartig, Peter Ebersbach, Erin McLellan, Matthew Sendelbach, Nedal Saleh, Narender Rana, Hiroki Kawada, Toru Ikegami, Masahiko Ikeno, Takahiro Kawasaki, Cornel Bozdog, Helen Kim, Elad Arnon, Roy Koret, Igor Turovets

Proceedings Volume 8324, 832404 (2012) https://doi.org/10.1117/12.916940

KEYWORDS: Line edge roughness, Scatterometry, Data modeling, Metrology, Critical dimension metrology, Metals, Semiconducting wafers, Extreme ultraviolet, Scatter measurement

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Proceedings Article | 23 March 2012 Paper

Computational study of line tip printability of sub-20-nm technology

Lei Yuan, Thomas Wallow, Deniz Civay, Linus Jang, Jongwook Kye, Harry Levinson, Sohan Singh, Mark Kelling

Proceedings Volume 8322, 832229 (2012) https://doi.org/10.1117/12.915868

KEYWORDS: Printing, Extreme ultraviolet, Optical lithography, Lithography, Extreme ultraviolet lithography, Photomasks, Lithographic illumination, Double patterning technology, Line edge roughness, Metals

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Proceedings Article | 20 March 2012 Paper

Assessment of negative tone development challenges

Sohan Mehta, Yongan Xu, Guillaume Landie, Vikrant Chauhan, Sean Burns, Peggy Lawson, Bassem Hamieh, Jerome Wandell, Martin Glodde, Yu Yang Sun, Mark Kelling, Alan Thomas, Jeong Soo Kim, James Chen, Hirokazu Kato, Chiahsun Tseng, Chiew-Seng Koay, Yoshinori Matsui, Martin Burkhardt, Yunpeng Yin, David Horak, Shyng-Tsong Chen, Yann Mignot, Yannick Loquet, Matthew Colburn, John Arnold, Terry Spooner, Lior Huli, Dave Hetzer, Jason Cantone, Shinichiro Kawakami, Shannon Dunn

Proceedings Volume 8325, 832506 (2012) https://doi.org/10.1117/12.917560

KEYWORDS: Semiconducting wafers, Polymers, Optical proximity correction, Reactive ion etching, Etching, Scanning electron microscopy, Neodymium, Photoresist developing, Image processing, Roads

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Proceedings Article | 13 March 2012 Paper

Defects reduction at BEOL interconnect within 300mm manufacturing environment

Chien-Hsien Lee, Yayi Wei, Mark Kelling, ShaoBeng Law, Morris Mobley, K. C. Chai

Proceedings Volume 8326, 83261S (2012) https://doi.org/10.1117/12.915654

KEYWORDS: Chemical mechanical planarization, Deep ultraviolet, Reactive ion etching, Lithography, Semiconducting wafers, Photomasks, Back end of line, 193nm lithography, Immersion lithography, Etching

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SPIE Journal Paper | 1 October 2011

Holistic metrology approach: hybrid metrology utilizing scatterometry, critical dimension-atomic force microscope and critical dimension-scanning electron microscope

Alok Vaid, Bin Bin Yan, Yun Tao Jiang, Mark Kelling, Carsten Hartig, John Allgair, Peter Ebersbach, Matthew Sendelbach, Narender Rana, Ahmad Katnani, Erin McLellan, Charles Archie, Cornel Bozdog, Helen Kim, Michael Sendler, Susan Ng, Boris Sherman, Boaz Brill, Igor Turovets, Ronen Urensky

JM3, Vol. 10, Issue 04, 043016, (October 2011) https://doi.org/10.1117/12.10.1117/1.3655726

KEYWORDS: Metrology, Scatterometry, Critical dimension metrology, Semiconducting wafers, Data modeling, Atomic force microscopy, Transmission electron microscopy, Inspection, 3D metrology

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Proceedings Article | 16 April 2011 Paper

Performance of tri-layer process required for 22 nm and beyond

Yayi Wei, Martin Glodde, Hakeem Yusuff, Margaret Lawson, Sang Yil Chang, Kwang Sub Yoon, Chung-Hsi Wu, Mark Kelling

Proceedings Volume 7972, 79722L (2011) https://doi.org/10.1117/12.879301

KEYWORDS: System on a chip, Etching, Silicon, Dielectrics, Semiconducting wafers, Particles, Coating, Reflectivity, Plasma etching, Plasma

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Proceedings Article | 29 March 2011 Paper

A holistic metrology approach: hybrid metrology utilizing scatterometry, CD-AFM, and CD-SEM

Alok Vaid, Bin Bin Yan, Yun Tao Jiang, Mark Kelling, Carsten Hartig, John Allgair, Peter Ebersbach, Matthew Sendelbach, Narender Rana, Ahmad Katnani, Erin Mclellan, Chas Archie, Cornel Bozdog, Helen Kim, Michael Sendler, Susan Ng, Boris Sherman, Boaz Brill, Igor Turovets, Ronen Urensky

Proceedings Volume 7971, 797103 (2011) https://doi.org/10.1117/12.881632

KEYWORDS: Metrology, Critical dimension metrology, Scatterometry, Semiconducting wafers, Metals, Transmission electron microscopy, Data modeling, Atomic force microscopy, Inspection

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Proceedings Article | 24 March 2009 Paper

Monitoring measurement tools: new methods for driving continuous improvements in fleet measurement uncertainty

Eric Solecky, Chas Archie, Matthew Sendelbach, Ron Fiege, Mary Zaitz, Dmitriy Shneyder, Carlos Strocchia-rivera, Andres Munoz, Srinivasan Rangarajan, William Muth, Andrew Brendler, Bill Banke, Bernd Schulz, Carsten Hartig, Jon-Tobias Hoeft, Alok Vaid, Mark Kelling, Benjamin Bunday, John Allgair

Proceedings Volume 7272, 72721H (2009) https://doi.org/10.1117/12.814089

KEYWORDS: Semiconducting wafers, Metrology, Scatterometry, Process control, Calibration, Manufacturing, Overlay metrology, Time metrology, Atomic force microscopy

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Ever shrinking measurement uncertainty requirements are difficult to achieve for a typical metrology toolset, especially over the entire expected life of the fleet. Many times, acceptable performance can be demonstrated during brief evaluation periods on a tool or two in the fleet. Over time and across the rest of the fleet, the most demanding processes often have measurement uncertainty concerns that prevent optimal process control, thereby limiting premium part yield, especially on the most aggressive technology nodes. Current metrology statistical process control (SPC) monitoring techniques focus on maintaining the performance of the fleet where toolset control chart limits are derived from a stable time period. These tools are prevented from measuring product when a statistical deviation is detected. Lastly, these charts are primarily concerned with daily fluctuations and do not consider the overall measurement uncertainty. It is possible that the control charts implemented for a given toolset suggest a healthy fleet while many of these demanding processes continue to suffer measurement uncertainty issues. This is especially true when extendibility is expected in a given generation of toolset. With this said, there is a need to continually improve the measurement uncertainty of the fleet until it can no longer meet the needed requirements at which point new technology needs to be entertained. This paper explores new methods in analyzing existing SPC monitor data to assess the measurement performance of the fleet and look for opportunities to drive improvements. Long term monitor data from a fleet of overlay and scatterometry tools will be analyzed. The paper also discusses using other methods besides SPC monitors to ensure the fleet stays matched; a set of SPC monitors provides a good baseline of fleet stability but it cannot represent all measurement scenarios happening in product recipes. The analyses presented deal with measurement uncertainty on non-measurement altering metrology toolsets such as scatterometry, overlay, atomic force microscopy (AFM) or thin film tools. The challenges associated with monitoring toolsets that damage the sample such as the CD-SEMs will also be discussed. This paper also explores improving the monitoring strategy through better sampling and monitor selection. The industry also needs to converge regarding the metrics used to describe the matching component of measurement uncertainty so that a unified approach is reached regarding how to best drive the much needed improvements. In conclusion, there will be a discussion on automating these new methods3,4 so they can complement the existing methods to provide a better method and system for controlling and driving matching improvements in the fleet.

Showing 5 of 9 publications

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